Hitachi EA6000VX: versatile micro-spot analyzer
The Hitachi High-Technologies line includes several configurations for in-house RoHS inspection but the Hitachi EA6000VX x-ray fluorescence analyzer is considered the premier system for this interest. The reason? This model features the high precision capabilities and easy to use software but also offers industry leading mapping functions that further increase laboratory efficiencies. Plus, it can perform RoHS screening and coating thickness, composition, etc...all in a single system.
Unlike any conventional system, the mapping function and continuous multi-point measurement software enables control of hazardous substances over entire surfaces and measurement of microscopic points at specific areas.
Unlike any conventional system, the mapping function and continuous multi-point measurement software enables control of hazardous substances over entire surfaces and measurement of microscopic points at specific areas.
PRIMARY APPLICATIONS:
RoHS Testing with High-Precision Mapping
Microscopic Area and Ultra Thin Coating Thickness
Elemental Analysis, quantification of Phosphorus in Electroless Nickel
RoHS Testing with High-Precision Mapping
Microscopic Area and Ultra Thin Coating Thickness
Elemental Analysis, quantification of Phosphorus in Electroless Nickel
Video Demonstrations
MAJOR ADVANCEMENTS AND FEATURES:
Link: Hitachi Website Intro to EA6000VX Features
High-Speed XRF Mapping: High count rate detector of 150,000cps at maximum and a large stage that scans up to a 250mm x 200mm area enables high speed mapping. In 100mm x 100mm area mapping, the EA6000VX detects and locates lead contained in terminals of mounting board in a few moments.
Vortex Detector; high-speed plus LN2 free: Equipped with the world's best in class, high count rate detector (15x improvement on count rate compared with a conventional model), the EA6000VX improves measurement efficiency. Additionally, the detector does not require LN2, which results in supporting safety and work efficiency of an operator.
Continuous Multi-Point Measurements: Up to 500 points can be set and continuously measured. Measuring large samples and boards, this feature exhibits tremendous throughput.
High Precision Overlap Function: Highly precise analysis over a wide area is enabled by the complete overlap of sample image and mapping image by employing a telecentric optic system and high precision XY stage. Areas that contain target elements are easily identified. Whole areas of 250mm x 200mm are shown in top view and position precision of zoom in from wide view within 100um.
See-Through Mapping Function: Beginning with Pb on internal boards, various mapping images of elements can be obtained without taking apart products with unknown internal structures (ie laptop computers, cell phones). Various information can be obtained about a samples structure and internal components by comparing mapping images of elements obtained by penetrating x-rays.
Contaminant Analysis: With the high speed mapping function, the EA6000VX is able to detect and locate small metal contaminants sized around tens of micro meters in wide measurement areas (max 250mm x 200mm). Small or minute amounts of contaminants contained in organic substances including resin can also be detected.
Light Element Measurement: With the He purge option, the Hitachi 6000VX is able to measure light elements from Na. It is a stable and unique system that purges He only during the measurement, which lowers the operating costs.
Auto-Approach and Sample Collision Prevention: The auto-approach function measures the sample height and automatically adjusts the distance between sample and detector so that an operator can easily measure samples with complicated shapes. In the case of manual operation, sample collision prevention prevents sample damage.
Link: Hitachi Website Intro to EA6000VX Features
High-Speed XRF Mapping: High count rate detector of 150,000cps at maximum and a large stage that scans up to a 250mm x 200mm area enables high speed mapping. In 100mm x 100mm area mapping, the EA6000VX detects and locates lead contained in terminals of mounting board in a few moments.
Vortex Detector; high-speed plus LN2 free: Equipped with the world's best in class, high count rate detector (15x improvement on count rate compared with a conventional model), the EA6000VX improves measurement efficiency. Additionally, the detector does not require LN2, which results in supporting safety and work efficiency of an operator.
Continuous Multi-Point Measurements: Up to 500 points can be set and continuously measured. Measuring large samples and boards, this feature exhibits tremendous throughput.
High Precision Overlap Function: Highly precise analysis over a wide area is enabled by the complete overlap of sample image and mapping image by employing a telecentric optic system and high precision XY stage. Areas that contain target elements are easily identified. Whole areas of 250mm x 200mm are shown in top view and position precision of zoom in from wide view within 100um.
See-Through Mapping Function: Beginning with Pb on internal boards, various mapping images of elements can be obtained without taking apart products with unknown internal structures (ie laptop computers, cell phones). Various information can be obtained about a samples structure and internal components by comparing mapping images of elements obtained by penetrating x-rays.
Contaminant Analysis: With the high speed mapping function, the EA6000VX is able to detect and locate small metal contaminants sized around tens of micro meters in wide measurement areas (max 250mm x 200mm). Small or minute amounts of contaminants contained in organic substances including resin can also be detected.
Light Element Measurement: With the He purge option, the Hitachi 6000VX is able to measure light elements from Na. It is a stable and unique system that purges He only during the measurement, which lowers the operating costs.
Auto-Approach and Sample Collision Prevention: The auto-approach function measures the sample height and automatically adjusts the distance between sample and detector so that an operator can easily measure samples with complicated shapes. In the case of manual operation, sample collision prevention prevents sample damage.